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Chip on Glass MEMs Fingerprint Sensor - Fidelica Microsystems
Project type
Fidelica MEMs based Fingerprint Sensor
Date
July 2002
Location
Milpitas Ca
As a Packaging Development Engineer, I developed an ACF (Anisotropic Conductive Film) flip chip assembly process for a unique (Fidelica Patents) MEMs based fingerprint sensor. I also developed a cable attach process and co-developed a (25 to 50 micron sized) silicon elastomer button process on a 15mm array of micro MEMs button switches, as well as several unique encapsulation processes for the same.
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