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Worlds First Silicon on Silicon System in a Package - Apple Saw 4 Chipset
Project type
Flip Chip Assembly - System in a Package
Date
June 1998
Location
Campbell, CA
1998 Alpine Microsystems The featured images are of a five component Apple "Saw 4" chip set. I developed the flip chip assembly process utilizing a state of the art (sub 5 micron accuracy) granite based (Micron 2) flip chip robot as well as a flux application (atomized spray) process of my design/invention. In addition I invented several unique underfill processes utilizing Infrared cameras and highly polished Si dummy chips of the same geometry.
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